Monthly output of Innolux’s low-cost, high volume FOPLP chip packaging has surged to over 40 million units per month, up 10X from last year, media report, and will continue to rise into the 2nd half of 2026. Innolux is working on Through-Glass Via (TGV) customer certification now, which is used in advanced packaging for AI chips that use glass substrates. The company won orders from SpaceX last year for Low Earth Orbit (LEO) satellite-related work. #SpaceX #Innolux
Source: Dan Nystedt
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