ASE broke ground on a new NT$17.6 billion (US$580 million) CoWoS advanced semiconductor packaging plant in Kaohsiung, Taiwan to meet explosive demand for AI chip packaging and testing services, media report. The plant, dubbed K18B, is set to be completed in the 1st quarter of 2028. It will sit near TSMC’s 2nm fabs in the Nanzih Science Park. $Advanced Semiconductor Engineering(ASX.US) $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) #semiconductors
Source: Dan Nystedt
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