ASE Technology sees advanced semiconductor packaging revenue up 10% this year on orders for ASIC and high-performance computing products, CEO Tien Wu said, media report, with R&D focused on FOCoS (Fan-Out Chip on Substrate) technology and fan-out panel-level packaging (FOPLP). ASE has spent US$200 million on a test panel level packaging production line as it leans more heavily into the high margin space. 1/2 $NVIDIA(NVDA.US) $Broadcom(AVGO.US) $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) #semiconductors #semiconductor
Source: Dan Nystedt
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