AMAT says almost all of leading edge purchases today are related to Gate-All-Around (GAA) or 2nm and below nodes. Sees 200 more steps for 2nm vs 3nm. 3nm has 1900 process steps, per AMAT. Also sees, HBM at 16% of DRAM wafer starts today (comments at BofA conference).
Source: Sravan Kundojjala
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