ABF Substrates are key to die disaggregation and #Chiplet adoption.
Traditional SoC CPU's used relatively simple substrates which were small, had only a few layers and non-complex wiring.Chiplet packages require large sized substrates (100 x 100mm), many layers (20-24) and very fine Line/Spacing (5/5).All together, these substrates are required for sophisticated packages, they are very difficult to make, and there are only a few reliable suppliers:#Ibiden, #Shinko and #Toppan in Japan, #ATS in Austria and #Unimicron in Taiwan.https://t.co/VJ8hViElzjSource: Chips & Wafers
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