LITE Commentator
Rate Of ReturnThis technology is beneficial for the entire CPO industry chain, accelerating the implementation of CPO technology.
$Corning(GLW.US) Corning has released a new CPO packaging technology.
The traditional CPO technology is fiber → FAU alignment → PIC, with FAU being the bottleneck (high precision requirements, high cost, difficult yield control).
Corning's new CPO approach is "fiber → glass waveguide → PIC," replacing mechanical alignment with semiconductor-grade processes.
To put this new technology in plain terms, it means optical fibers no longer need to be soldered onto optical modules; they can be directly plugged into pre-embedded channels in the glass.
This technology will ultimately accelerate the mass production timeline for CPO.
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