
Nomura: DRAM/NAND Wafer Capacity
Samsung Electronics> DRAM Capacity Growth: SEC’s DRAM capacity is projected to expand significantly from 655k wafers/month at the end of 2024 to 1,264k wafers/month by the end of 2030, driven by heavy capacity additions in phases like P4, P5, and P6. Year-over-year (y-y) growth peaks notably in 2030 at 22%.> NAND Capacity Trends: NAND capacity fluctuates in the near term (with dips in 2025 and 2027), but ramps up significantly toward the end of the decade, reaching 533k wafers/month by the end of 2030 with a 29% y-y growth.SK Hynix> DRAM Expansion: SK Hynix ramps up total DRAM capacity from 474k in 2024 to 1,183k wafers/month by end-2030. Major growth spurts are expected in 2028 (25% y-y growth) and 2030 (26% y-y growth), largely supported by new expansions in the Y1, Y2, and Y3 phases.> NAND Trajectory: After experiencing capacity contractions between 2025 and 2027, SK Hynix's NAND production surges sharply starting in 2028 (up 58% y-y) to hit 580k wafers/month by end-2030.Micron> DRAM Growth & Regional Split: Micron’s DRAM capacity grows steadily from 310k in 2024 to 690k wafers/month by end-2030. Expansion is anchored by both its Taiwan facilities (scaling from 195k to 430k) and its US/Japan operations.> NAND Stability: Micron’s NAND capacity remains stable at 130k wafers/month through 2026 before expanding via new fab lines (such as Fab 10 B and Fab 11) to reach 280k wafers/month by 2029–2030.$Micron Tech(MU.US) $DRAM $EWYThe copyright of this article belongs to the original author/organization.
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