ABF substrate makers are being forced to move faster on expansion plans as AI chip die get bigger, driving demand for larger substrates, media report, noting long term agreements (LTAs) are no longer enough: clients are paying firms to launch 2029-2030 expansion plans now, using a variety of methods:
-prepayments-client pays for production line equipment-joint factory construction and more-Unimicron raised 2026 capex to NT$53.7 billion-ZDT Group subsidiary, Leading Interconnect (China) to expand to 7 or more plants in Shenzhen by 2030-Kinsus Interconnect added NT$19.6 billion in capex over 3-years (projected NT$14B 2026 and NT$16B 2027)-Nan Ya PCB is seen raising capex to expand existing plants, and will lease & convert a plant in south TaiwanAMD CEO Lisa Su recently visited Taiwan, announcing US$10 billion in investments aimed at the supply chain, including the EFT (Elevated Fanout Bridge) advanced packaging ecosystem – and media say substrate makers figure prominently in that. $AMD(AMD.US) $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) #Unimicron #Kinsus #NanYaPCBSource: Dan Nystedt
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
Post your comment
No Comments