TSMC vs Intel: TSMC is working with Kinsus Interconnect to develop an EMIB-like technology to keep customers from switching to Intel’s EMIB advanced packaging, media report. Intel’s EMIB uses silicon bridges between chips for interconnect, instead of the silicon interposer TSMC uses in CoWoS packaging. Kinsus is a substrate maker and would provide bridge embedding work and manufacturing expertise. There has been talk Google might turn to Intel for EMIB. $Taiwan Semiconductor(TSM.US) $Intel(INTC.US) #semiconductors

Source: Dan Nystedt