AUO, the display panel maker, plans to spend NT$8.64 billion (US$267M) for an FOPLP advanced chip packaging pilot line that uses glass substrates: Glass Core (structure), Redistribution Layer (RDL, fine metal wiring) and Through Glass Via (TGV, tiny holes drilled through the glass to connect layers). FOPLP plans aim at LEO satellite antennas, Micro LEDs and optical communications. AUO’s main rival in Taiwan, Innolux, has already started developing its advanced semiconductor packaging business. In February, AUO’s board approved NT$14.67B in capex spending. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) #advancedpackaging #semiconductors
Source: Dan Nystedt
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
