TSMC production of Photonic Integrated Circuits (PIC), the key light chip in co-packaged optics (CPO), is ramping hard. Media reports note monthly capacity is climbing to 10,000 wafers-per-month (wpm) as of Q2, up from 500wpm earlier—boosting annualized PIC output to 78 million chips (up from 4M). By Q4, TSMC is projected to hit 15,000wpm, and at least 25,000wpm by 2028. The AI industry is turning to light signals to transfer more data, far faster, as electrical signals hit physical limits. The report cites institutional investor estimates basing the figures on 648-die-per-wafer. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) #semiconductors
Source: Dan Nystedt
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