TSMC will outsource CoWoS work to Amkor Arizona as part of the 10-year deal they inked, and TSMC’s first US advanced packaging plant (AP1) will focus on SoIC packaging instead, media report.
CoWoS (Chip on Wafer on Substrate): 2.5D packaging, older than SoIC (3D).SoIC (Silicon on Integrated Chips) $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) #semiconductorsSource: Dan Nystedt
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