TSMC plans to convert several older, 8-inch wafer fabs into advanced packaging plants as the shortage worsens, media report, while next-gen CoPoS mass production is planned for 2028-2029 at plant AP7 in Chiayi, south Taiwan. Chiayi is TSMC’s biggest advanced packaging site. CoWoS advanced packaging volume is expected to reach 2 million wafers in 2027, from 1.3 million this year. 1/2 $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) #semiconductors #semiconductor
Source: Dan Nystedt
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