#SKHynix is considering doing something counterintuitive, but something which may ultimately drive adoption of #HybridBonding for #HBM.
Historically, SK Hynix has looked to thin dies as much as possible; this allowed for more dies to be stacked within the JEDEC accepted height limitations.But, thinner dies are also more likely to experience performance degradation and damage from external shocks. Now, in an effort to drive HBM stack performance, the memory maker is looking to reduce die thinning and use thicker dies within their HBM stacks.This all makes sense from a performance perspective. But how do you increase die per stack AND increase die thickness simultaneously, all while limiting stack height to sub 775 (or the new JEDEC proposed height)?The answer may just be...Hybrid Bonding. ▶️Increase the die thickness and reduce the space between dies. That's Hybrid Bonding.Source: Chips & Wafers
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