Meta’s MTIA-3 AI chip will debut in the 2nd half of 2026, made on TSMC’s 3nm process, and Broadcom the design partner for compute and I/O, media report. The chip features more I/O, an added SoC chip, and eight HBM3E 12Hi stacks per CoWoS package. Meta’s MTIA-2 chip is in production now on TSMC 3nm with CoWoS-S packaging, and will roll out in the 1st half 2026. Meta is also building MTIA server systems. $Meta Platforms(META.US) #AIservers #semiconductors
Source: Dan Nystedt
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