Rumor: Tesla and Apple are exploring glass substrates for advanced semiconductor packaging due to superior heat dissipation compared to other materials, media report, which can warp under high temperatures in large chips like those for AI servers, media report, adding glass substrates may replace silicon interposers, but are not yet essential. $Tesla(TSLA.US) $Apple(AAPL.US) $Taiwan Semiconductor(TSM.US) #semiconductors
Source: Dan Nystedt
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