TSMC and local rivals are making steady progress in advanced panel-level packaging (FOPLP), with mass production expected by 2027, media report. New equipment has passed muster, and trial production lines humming. Powertech, Taiwan’s 2nd largest chip packaging firm, achieved a 90% yield rate on its 515x515mm FOPLP trial line, while ASE is working on 600x600mm panels and Innolux on 700x700mm. TSMC is focusing on 315x315mm panels, with an FOPLP R&D team, a trial production line, and investments in PLP+TGV and glass substrate technologies. 1/2 $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) #Powertech #Innolux
Source: Dan Nystedt
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