TSMC and ASE executives oversaw the launch of the 3DIC Advanced Packaging Manufacturing Alliance in Taipei on Tuesday with 37 firms, mostly Taiwanese but a few others, including equipment makers Disco, TEL (Japan), BE Semiconductor (Besi, Netherlands), media report, adding TSMC VP, Operations/Advanced Packaging Jun He said localization was vital for collaboration to speed up development of new equipment and materials. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Tokyo Electron(TOELY.US) #semiconductors
Source: Dan Nystedt
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