TSMC is racing to finish verification of its COUPE silicon photonics engine this year to integrate it into the CoWoS packaging next year for a complete co-packaged optics (CPO) product, aimed at boosting data speeds in AI data centers while cutting energy use, media report, adding key partners include subsidiary VisEra Technologies and US-based Marvell. The report says TSMC filed for 50 patents related to silicon photonics in the US last year, versus 26 for Intel. $Taiwan Semiconductor(TSM.US) $Marvell Tech(MRVL.US) $Intel(INTC.US) #semiconductors
Source: Dan Nystedt
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