Japan’s Resonac, the semiconductor materials giant, has established a 27-company consortium (JOINT3) to develop materials, equipment and design tools for 515 x 510mm square organic interposers for next-gen advanced chip packaging (panel-level-packaging), media report. The group will invest 26 billion yen ($175 million) over 5-years to build a prototype production line at an R&D center in Yuki City, north of Tokyo. They aim to have it up and running next year. $Applied Materials(AMAT.US) $CAJ $Lam Research(LRCX.US) $3M(MMM.US) $Synopsys(SNPS.US) $Tokyo Electron(TOELY.US) #semiconductors
Source: Dan Nystedt
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