TSMC will detail its upcoming co-packaged optics (CPO) silicon photonics solution at SEMICON Taiwan (9/10-12), aimed at greatly boosting computing speeds in AI data centers, media report, adding TSMC’s COUPE silicon photonics engine combines an electronics chip (EIC) made on 6nm process with a photonics chip (PIC) on 65nm in an innovative 3D IC (EIC-on-PIC) advanced package. The chips are expected to be in mass production in 2026. The report cites unnamed industry sources. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) #semiconductors
Source: Dan Nystedt
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