TSMC plans to build its first CoPoS (Chip-on-Panel-on-Substrate) advanced semiconductor packaging test line next year, but volume production will wait until 2028-2029 at Chiayi, south Taiwan AP7 plants P4 and P5, DigiTimes reports, citing unnamed supply chain sources. 1/3 $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $AMD(AMD.US) $Broadcom(AVGO.US)
Source: Dan Nystedt
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
