TSMC’s expansion of CoWoS advanced chip packaging capacity appears to have hit some turbulence, media report, with the AP5 complex in the Central Taiwan Science Park set to merge operations & personnel at plants AP5A and AP5B due to falling capacity utilization; while at the AP8 complex in the Southern Taiwan Science Park, much equipment has arrived, but installation has been delayed to the end of 2025. 1/2 $NVIDIA(NVDA.US) $AMD(AMD.US) $Broadcom(AVGO.US) $Alphabet(GOOGL.US) #Semiconductors
Source: Dan Nystedt
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