TSMC plans to ramp 2nm capacity to 100,000 wafers per month (wpm) next year from 40,000wpm this year due to strong demand from major clients Apple, AMD, Intel, Qualcomm, MediaTek, Nvidia and others, media report, citing unnamed industry sources, and adding TSMC will double capacity again to 200,000wpm in 2027 when it becomes TSMC’s biggest advanced process node by capacity. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $Apple(AAPL.US) $AMD(AMD.US) $Intel(INTC.US) $Qualcomm(QCOM.US) #mediatek #semiconductors
Source: Dan Nystedt
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