Interesting clarification regarding the situation with Hybrid Bonding tools for #HBM in S. Korea
The company has been selected to lead a 14 billion won project, with 7.5 billion won directly from the government, by the Ministry of Trade, Industry and Energy to develop a hybrid bonding stack equipment for very large-scale integration semiconductor HBM.출처 : THE ELEC, Korea Electronics Industry Media(Source: Chips & Wafers
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