TSMC Arizona already has civil engineers prepping construction on fab 3, while the 2nd fab is ahead of schedule, with workers already moving in equipment, media report, citing unnamed supply chain sources. Fabs 4-6 are to be expedited, as are 2 advanced packaging plants. TSMC is already figuring its personnel needs for 2026 advanced packaging. 1/3 $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $AMD(AMD.US) $Qualcomm(QCOM.US) $Apple(AAPL.US) #Arizona #semiconductors
Source: Dan Nystedt
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