Microsoft and Meta have both turned to Taiwan contract chip designer Global Unichip (GUC) for work on their ASIC chips, including TSMC CoWoS-R advanced packaging, media report, citing unnamed supply chain sources, and adding GUC taped-out 2nm test chips at TSMC in Q3 last year and won verification on 3nm interconnect IP in Q1 this year. 1/3 $Microsoft(MSFT.US) $Meta Platforms(META.US) $Taiwan Semiconductor(TSM.US) #semiconductors
Source: Dan Nystedt
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