Apple has joined Nvidia as a major customer for TSMC’s specialty advanced packaging processes, as the A20 iPhone chips are set to use WMCW (Wafer Level Multi-Chip Module) packaging, media report, and WMCW capacity seen at 10,000 wafers per month in 2026. Apple will also tap TSMC for SoIC (System on Integrated Chips) packaging for its AI server chips. The server chips will be packaged at TSMC’s AP6 plant in Zhunan, Taiwan. $Apple(AAPL.US) $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) #semiconductors #semiconductor
Source: Dan Nystedt
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