ASE said this year its advanced chip testing capacity will grow twice as much as packaging capacity and account for 19%-20% of revenue in its chip packaging/testing division, media report, adding ASE also plans to move FOPLP (Fan-out Panel Level Packaging) equipment into a plant in the 2nd half 2025 and begin pilot production by year-end. In early 2026, ASE may begin customer verification. $Advanced Semiconductor Engineering(ASX.US) #semiconductor #semiconductors
Source: Dan Nystedt
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