
Professor Kim Joung-ho of KAIST, a leading expert in #HBM, presented a fantastic roadmap for the future of #HBM through 2040.
Implications for HBM Packaging: 👉No Hybrid Bonding until HBM6 in 2032👉Thinner DRAM allow for 20 high stacks < 720 micronSource: Chips & Wafers
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