AMD confirmed Samsung’s latest HBM3E 12-Hi will be used with its latest AI accelerators, the MI350 series, media report, a relief for Samsung due to ongoing delays to win certification by Nvidia. AMD announced 2 new chips, the MI350X and MI350X, which can each take up to 288GB of HBM (High Bandwidth Memory) capacity. $AMD(AMD.US) #Samsung #semiconductors
Source: Dan Nystedt
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