ASE Announces FOCoS-Bridge With TSV; Latest Package Technology Next-Generation #AI and #HPC Applications
It's been a strange period where $Taiwan Semiconductor(TSM.US) has been focused on Packaging rather than just Front-End chip development.It's not surprising that the OSATs are going to come in strong to win back their traditional packaging business.The two key OSATs to watch are #ASE in Taiwan (3711) and $Amkor Tech(AMKR.US) in the USA.Source: Chips & Wafers
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