RE: $ASML(ASML.US) - BIG STORYCompanies are all working on a multi-patterning approach to delay the adoption of expensive High-NA EUV toolsEzequiel Russell, Sr. Director of mask technology at $Micron Tech(MU.US):👉All the techniques we used to extend immersion…are now being applied to EUV👉Right now, to my knowledge, all the nodes in high-volume production using EUV, both memory and logic, are doing single-patterning EUV. But every company in R&amp;D, across both logic and memory, is working on some kind of EUV multi-patterning for their next node👉For most applications, High-NA is going to struggle to compete with multi-patterned EUV on cost.Source: Chips &amp; Wafers