Micron plans to outsource all HBM2 chip packaging to longtime Taiwan partner Powertech Technology, media report, with pilot production to begin in the 2nd half of 2025 (earliest) and mass production in 2026. HBM2, high bandwidth memory chips, are a few generations behind leading edge HBM3E. $Micron Tech(MU.US) #Powertech #semiconductors #semiconductor
Source: Dan Nystedt
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