TSMC may rein in CoWoS expansion due to US tariffs, investment banks say, media report, with Morgan Stanley forecasting 2026 CoWoS capacity at 90,000 wafers per month (wpm), up from 70,000 wpm this year, and versus a consensus 2026 view of 105,000-125,000. Goldman Sachs reportedly shaved its 2026 capex outlook to US$45 billion from $46 billion and CoWoS shipments to 660,000 total in 2025 and 1 million in 2026. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $Broadcom(AVGO.US) $AMD(AMD.US) #semiconductors #cowos #semiconductor https://t.co/iTPSjkgDqA
Source: Dan Nystedt
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