TSMC, Intel slow expansions in Japan, Malaysia amid weak demand for mature chips and tariff uncertainty, Nikkei reports, notes TSMC delayed 16/12nm equipment purchases to 2026; Intel delayed equipment orders for a Malaysia packaging plant. ASE and SPIL have also shifted into "wait and see" mode on Malaysia packaging plant expansions. $Taiwan Semiconductor(TSM.US) $Intel(INTC.US) $Advanced Semiconductor Engineering(ASX.US) #Semiconductors #semiconductor https://t.co/p5vOlCSyVk
Source: Dan Nystedt
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