TSMC’s new advanced semiconductor packaging plants, AP8 in Tainan and AP7 in Chiayi, (south Taiwan) will start production in late 2025, media report. Staff from TSMC’s 8-inch fabs are being sent to support the new plants’ ramp up of SoIC packaging, the focus of future chips. First used by AMD, SoIC is slated for Apple’s M5 in the 2nd half 2025 and Nvidia’s Rubin GPU, its debut chiplet design. $Taiwan Semiconductor(TSM.US) $AMD(AMD.US) $Apple(AAPL.US) $NVIDIA(NVDA.US) #semiconductors #semiconductor https://t.co/7kFylhG81w
Source: Dan Nystedt
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