Report: Supply chain news indicates that after Apple, NVIDIA's next-generation GPU will also collaborate with Intel to please Trump

Following Apple, NVIDIA also plans to shift part of its chip manufacturing business to Intel's foundry. NVIDIA's Feynman architecture platform, expected to launch in 2028, will collaborate with Intel, marking the latest case of American tech giants adjusting their supply chain strategies under the "Made in America" goal promoted by the Trump administration.

According to a report by DIGITIMES on Wednesday, supply chain insiders revealed that NVIDIA will adopt a "small volume, low-end, non-core" collaboration strategy with Intel. The core GPU chips will still be manufactured by TSMC, while the I/O chips will partially use Intel's 18A process or the 14A process scheduled for mass production in 2028, with advanced packaging ultimately done by Intel's EMIB. In terms of advanced packaging share, Intel accounts for about 25%, while TSMC accounts for about 75%.

This shift reflects the necessity for American tech companies to move from a highly concentrated model focused on TSMC to a new strategy of "multi-source supply and risk diversification" under political pressure, tariff threats, and supply chain resilience considerations. In addition to NVIDIA and Apple, companies such as Google, Microsoft, AWS, Qualcomm, Broadcom, AMD, and Tesla are also in discussions with Intel for collaboration.

Although some orders are being diverted to Intel, the industry believes that this is "far more beneficial than harmful" for TSMC, as it helps alleviate monopoly concerns and political pressure, while TSMC remains confident in securing large orders for high-end chip foundry services.

NVIDIA Feynman Architecture Partially Shifts to Intel

After announcing a $5 billion investment in Intel in September 2025, NVIDIA's latest plan is to collaborate with Intel on the next-generation successor to the Rubin series, the Feynman architecture chip. According to supply chain sources, the core GPU chips will still be manufactured by TSMC, while the I/O chips will partially use Intel's 18A or 14A process, with the specific choice depending on the subsequent yield of the 14A mass production.

Supply chain insiders indicated that under the established "Made in America" goal and tariff pressures during the Trump administration, major American chip manufacturers had already discussed collaboration with Intel. However, as the 18A did not meet customer expectations, the collaboration is expected to occur with the 14A process scheduled for mass production in 2028. Intel's CEO, Pat Gelsinger, recently stated that two customers are currently evaluating the specific details of the 14A process.

Compared to the high risks associated with the introduction of the 14A and 18A processes, most companies are starting their collaboration with Intel through advanced packaging EMIB first. Supply chain analysts note that the "Made in America" goal faces challenges in cost and yield, but under the realities of political, supply chain resilience, and TSMC's limited advanced packaging capacity, major American chip manufacturers will inevitably initiate a dual-foundry strategy.

Apple Restarts Collaboration with Intel for Entry-Level Processors

The collaborative foundry product that Apple has been discussing with Intel for some time is likely the "entry-level M series processors" used in MacBooks, which are currently manufactured by TSMC. Apple's Mac series has been using Intel x86 processors since 2006, and Intel established a dedicated production line for it in 2005 at its wafer fab in Oregon, USA, specifically for the "Apple Group." In June 2020, Apple officially announced the launch of its Arm architecture chip "Apple Silicon," with all Mac series models transitioning to self-developed chips two years later. At that time, Apple's main considerations were to expand supply chain control and integrate its ecosystem, while another key factor was the delay in Intel's 10nm process, which could affect the launch of new Mac models.

Supply chain sources revealed that the main reason Apple restarted cooperation with Intel three years later was still the manufacturing goals and tariff impacts led by Trump, followed by factors such as cost, diversifying single-manufacturer risks, and capacity shortages.

TSMC's Three-Layer Strategy to Address Customer Diversion

Currently, it is observed that Apple and NVIDIA are gradually adjusting with products that have the lowest outsourcing risks. Other companies negotiating cooperation with Intel include Google, Microsoft, AWS, Qualcomm, Broadcom, AMD, and Tesla, as well as large contracts with the U.S. government that have the highest control. However, whether Intel can meet the demands of technology leaders who are already accustomed to TSMC's model remains uncertain.

For TSMC, it has anticipated that many customers will turn to Intel for wafer production, but analysts believe that the actual "benefits far outweigh the drawbacks," with at least three strategic considerations: First, it can reduce monopoly and regulatory concerns; second, it can alleviate political pressure from the U.S.; third, the spillover is only "non-core" orders, which helps with future bargaining and supply.

On one hand, this alleviates concerns that TSMC's high market share in the wafer foundry industry could involve antitrust laws; on the other hand, moderately releasing non-core orders can also reduce pressure from the Trump administration's various demands. Furthermore, TSMC remains confident in securing core high-end chip foundry orders from major manufacturers. Perhaps customers who have tried transferring orders to other foundries will miss the advantages of TSMC, which will provide TSMC with greater leverage in future negotiations and supply.

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