Report: NVIDIA has secured over 70% of Taiwan Semiconductor's advanced packaging capacity this year
NVIDIA has secured over 70% of Taiwan Semiconductor's CoWoS-L advanced packaging capacity this year due to strong demand for its latest Blackwell architecture GPU chips, with expected shipments to grow by more than 20% quarter-on-quarter
Industry news reports that NVIDIA's latest Blackwell architecture GPU chips are in strong demand, having secured over 70% of TSMC's advanced CoWoS-L packaging capacity this year, with shipments increasing by more than 20% quarter-on-quarter each season. (Taiwan Economic Daily)
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