Report: Apple's M5 chip has officially entered mass production, with the first devices equipped with the M5 expected to be launched by the end of the year
According to reports, the Apple M5 chip has entered mass production, and devices equipped with the M5 chip are expected to be released by the end of 2025. TSMC is using the latest N3P third-generation 3-nanometer process to produce the M5 chip, which offers a performance improvement of about 5% and a power consumption reduction of 5%-10% compared to previous processes. In addition, the M5 chip utilizes TSMC's latest SoIC-MH packaging technology, which enhances the chip's integration density and performance
On Wednesday Eastern Time, according to South Korean media ETnews, Apple's M5 chip has entered mass production, a development that meets expectations. The first devices equipped with the M5 chip are expected to be launched by the end of 2025.
TSMC is currently working on packaging the Apple M5 chip, which is the final step before mass production of the new chip, indicating that the M5 chip has officially entered the mass production phase.
The M5 chip will gradually be applied to the following products:
iPad Pro: The new iPad Pro equipped with the M5 chip is expected to be released by the end of 2025;
Mac series: The M5 chip version of the Mac computer is planned to be launched by the end of the same year;
Apple Vision Pro: Rumors suggest that the second generation of Apple Vision Pro will be equipped with the M5 chip and will debut before the end of 2025.
The Apple M5 series chips will include multiple versions: M5, M5 Pro, M5 Max, and M5 Ultra. It is reported that the standard version of the M5 chip will first be used in the new iPad Pro.
It is worth noting that the M5 chip continues the architectural design from the M1 to M4 series, with the CPU and GPU integrated on the same chip. However, it is rumored that the M5 Pro version may adopt a "separate design" for the first time, separating the GPU and CPU.
The Apple M5 chip will also utilize TSMC's latest SoIC-MH packaging technology. SoIC (System-on-Integrated-Chips) is a multi-chip stacking integration solution that achieves wafer-level integration in processes below 10 nanometers. This technology uses a no-bump structure, improving the chip's integration density and performance.
Reports indicate that TSMC will use its latest N3P process technology to produce the M5 chip. N3P is TSMC's third-generation 3-nanometer process, which offers about a 5% performance improvement and a 5%-10% reduction in power consumption compared to previous processes.
Currently, Apple's A18, A18 Pro, M4, M4 Pro, and M4 Max chips all use TSMC's second-generation N3E process, while the M5 series will be among the first chips to use the N3P process, which is expected to be applied to the iPhone 18 series products first